Invention Grant
- Patent Title: Circuit element
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Application No.: US17495849Application Date: 2021-10-07
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Publication No.: US11869701B2Publication Date: 2024-01-09
- Inventor: Hideaki Kobayashi , Kentaro Mikawa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP 19104700 2019.06.04
- Main IPC: H02H1/00
- IPC: H02H1/00 ; H01F27/28 ; H01F27/29 ; H01F27/40 ; H01F41/04 ; H01G4/40

Abstract:
A circuit element includes a multilayer body including insulating substrates, a first coil conductor inside the multilayer body, and first and second outer electrodes and a ground electrode on outer surfaces of the multilayer body. The first coil conductor includes a winding axis extending in a stacking direction of the insulating substrates, the first coil conductor is connected to the first outer electrode, the second outer electrode, or the ground electrode, and the second outer electrode extends along a side surface of the multilayer body. An additional capacitance is generated between the second outer electrode and the first coil conductor. The second outer electrode includes first and second portions with different widths in a layer direction of the insulating substrates and the width of the second portion is larger than the width of the first portion.
Public/Granted literature
- US20220028597A1 CIRCUIT ELEMENT Public/Granted day:2022-01-27
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