- Patent Title: Multilayered capacitor and board having the same mounted thereon
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Application No.: US17868281Application Date: 2022-07-19
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Publication No.: US11869723B2Publication Date: 2024-01-09
- Inventor: Yong Park , Sim Chung Kang , Jong Ho Lee , Hyung Soon Kwon , Woo Chul Shin
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20190084958 2019.07.15
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/012 ; H01G4/248 ; H01G4/12 ; H01G4/232

Abstract:
A multilayer capacitor includes: a capacitor body including first and second internal electrodes alternately stacked with a dielectric layer interposed therebetween, and having first to six surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, the second internal electrode being exposed through the fourth, fifth, and sixth surfaces; first and second side portions disposed on the fifth and sixth surfaces of the capacitor body; and first and second external electrodes. The capacitor body includes upper and lower cover portions disposed on an upper surface of an uppermost internal electrode and a lower surfaces of a lowermost internal electrode, respectively, in a stacking direction of the first and second internal electrodes. The first and second side portions and the upper and lower cover portions include zirconium (Zr).
Public/Granted literature
- US20220351910A1 MULTILAYERED CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON Public/Granted day:2022-11-03
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