Invention Grant
- Patent Title: Substrate processing apparatus, substrate processing method and non-transitory computer-readable recording medium
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Application No.: US17943843Application Date: 2022-09-13
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Publication No.: US11869764B2Publication Date: 2024-01-09
- Inventor: Akinori Tanaka , Hideto Tateno , Sadayoshi Horii
- Applicant: KOKUSAI ELECTRIC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Volpe Koenig
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C23C16/40 ; H01L21/67 ; C23C16/56 ; C23C16/455 ; C23C16/448 ; H01L21/31 ; C23C16/44 ; H01J37/32

Abstract:
Described herein is a technique capable of acquiring, monitoring and recording the progress of the reaction between a substrate and a reactive gas contained in a process gas in a process chamber during the processing of the substrate. According to the technique, there is provided a substrate processing apparatus including: a process chamber accommodating a substrate; a process gas supply system configured to supply a process gas into the process chamber via a process gas supply pipe; an exhaust pipe configured to exhaust an inner atmosphere of the process chamber; a first gas concentration sensor configured to detect a first concentration of a reactive gas contained in the process gas in the process gas supply pipe; and a second gas concentration sensor configured to detect a second concentration of the reactive gas contained in an exhaust gas in the exhaust pipe.
Public/Granted literature
Information query
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