Invention Grant
- Patent Title: Method for silicidation of semiconductor device, and corresponding semiconductor device
-
Application No.: US17338379Application Date: 2021-06-03
-
Publication No.: US11869772B2Publication Date: 2024-01-09
- Inventor: Denis Monnier , Olivier Gonnard
- Applicant: STMicroelectronics (Crolles 2) SAS
- Applicant Address: FR Crolles
- Assignee: STMicroelectronics (Crolles 2) SAS
- Current Assignee: STMicroelectronics (Crolles 2) SAS
- Current Assignee Address: FR Crolles
- Agency: Slater Matsil, LLP
- Priority: FR 57187 2018.08.01
- The original application number of the division: US16515805 2019.07.18
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/28 ; H01L21/8234 ; H01L21/285

Abstract:
A exemplary semiconductor device includes a first gate structure overlying a surface of the semiconductor body, the first gate structure being silicided. A second gate structure overlies the surface of the semiconductor body and not being silicided. An oxide layer overlies the second gate structure and extends toward the first gate structure. A silicon nitride region is laterally spaced from the second gate structure and overlies a portion of the oxide layer between the first gate structure and the second gate structure.
Public/Granted literature
- US20210296129A1 METHOD FOR SILICIDATION OF SEMICONDUCTOR DEVICE, AND CORRESPONDING SEMICONDUCTOR DEVICE Public/Granted day:2021-09-23
Information query
IPC分类: