Invention Grant
- Patent Title: Electrostatic chuck and substrate fixing device
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Application No.: US17160911Application Date: 2021-01-28
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Publication No.: US11869793B2Publication Date: 2024-01-09
- Inventor: Hiroyuki Kobayashi , Akihiro Kuribayashi
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano
- Agency: Rankin, Hill & Clark LLP
- Priority: JP 20014637 2020.01.31
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67

Abstract:
An electrostatic chuck is configured to adsorb and retain an object thereon. The electrostatic chuck includes: a base body on which the object is mounted; an electrostatic electrode that is provided in the base body; a plurality of heating elements that are provided in the base body; a plurality of current control elements that are provided in the base body, and each of which is connected in series with a corresponding one of the heating elements; and a control circuit that is provided in the base body, and that is connected to the current control elements and configured to control operations of the current control elements.
Public/Granted literature
- US20210242065A1 ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE Public/Granted day:2021-08-05
Information query
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