Invention Grant
- Patent Title: Planarization apparatus, planarization process, and method of manufacturing an article
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Application No.: US17122910Application Date: 2020-12-15
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Publication No.: US11869813B2Publication Date: 2024-01-09
- Inventor: Xiaoming Lu
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc., IP Division
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/67 ; H01L21/56

Abstract:
A method of real time leveling control between a superstrate and a substrate is provided. A contact force model indicating a relationship between a total contact force for planarization of a formable material between the superstrate and the substrate and a force component of the total contact force along each of a plurality peripheral axes is identified. A set point force required for performing the planarization is determined. Each force component is calculated based on the contact force model. The planarization is performed by applying each force component along a corresponding axis of the plurality of axes. The contact force model is identified based on a parallel condition between two contacting surfaces of a superstrate chuck for retaining the superstrate and a stack of the superstrate, the substrate, and formable material between the superstrate and the substrate.
Public/Granted literature
- US11823963B2 Planarization apparatus, planarization process, and method of manufacturing an article Public/Granted day:2023-11-21
Information query
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