Invention Grant
- Patent Title: Semiconductor package through hole with lever arms and insulating layers with different coefficient of thermal expansion
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Application No.: US17344842Application Date: 2021-06-10
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Publication No.: US11869828B2Publication Date: 2024-01-09
- Inventor: Yi-Chi Chen , Ming-Han Wang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L27/146 ; H01L21/768
Abstract:
A semiconductor package includes a first die. The first die includes a semiconductor substrate. The semiconductor substrate has a first surface, a second surface opposite to the first surface, and a through hole between the first surface and the second surface and having an inner wall. The inner wall has a first lever arm. A length of the first lever arm is less than a thickness of the semiconductor substrate.
Public/Granted literature
- US20220399250A1 SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-12-15
Information query
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