- Patent Title: Semiconductor device packaging extendable lead and method therefor
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Application No.: US17382835Application Date: 2021-07-22
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Publication No.: US11869837B2Publication Date: 2024-01-09
- Inventor: Mei Yeut Lim
- Applicant: NXP B.V.
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Agent Robert J. Amedeo
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498 ; H01L21/48 ; H01L25/065
Abstract:
A method of manufacturing a semiconductor device is provided. The method includes attaching a first end of a first bond wire to a first conductive lead and a second end of the first bond wire to a first bond pad of a first semiconductor die. A conductive lead extender is affixed to the first conductive lead by way of a conductive adhesive, the lead extender overlapping the first end of the first bond wire. A first end of a second bond wire is attached to the lead extender, the first end of the second bond wire conductively connected to the first end of the first bond wire.
Public/Granted literature
- US20230027248A1 SEMICONDUCTOR DEVICE PACKAGING EXTENDABLE LEAD AND METHOD THEREFOR Public/Granted day:2023-01-26
Information query
IPC分类:
