Invention Grant
- Patent Title: Flexible electronic assembly
-
Application No.: US17845969Application Date: 2022-06-21
-
Publication No.: US11869883B2Publication Date: 2024-01-09
- Inventor: Chandra Lius , Yuan-Lin Wu
- Applicant: InnoLux Corporation
- Applicant Address: TW Miao-Li County
- Assignee: InnoLux Corporation
- Current Assignee: InnoLux Corporation
- Current Assignee Address: TW Miao-Li County
- Agent Winston Hsu
- Main IPC: G02F1/1333
- IPC: G02F1/1333 ; H01L27/01 ; H10K50/844 ; H10K59/00 ; H10K77/10 ; H01L27/02 ; H01L27/12 ; H01L29/06 ; H01L29/417 ; H01L29/786 ; G02F1/133 ; G02F1/1343 ; G02F1/1347 ; G02F1/153 ; G09F9/30 ; H10K59/12 ; H10K102/00

Abstract:
A flexible electronic assembly includes an electronic component, a flexible substrate and a supporting layer. The flexible substrate includes a first surface coupled to the electronic component and a second surface opposite to the first surface. The supporting layer is coupled to the second surface, and the supporting layer includes a plurality of protrusions. In a plan view of the flexible electronic assembly, one of the plurality of protrusions includes at least a rounded corner.
Public/Granted literature
- US20220320067A1 FLEXIBLE ELECTRONIC ASSEMBLY Public/Granted day:2022-10-06
Information query
IPC分类: