Invention Grant
- Patent Title: Polysilicon resistor structures
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Application No.: US17870415Application Date: 2022-07-21
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Publication No.: US11869888B2Publication Date: 2024-01-09
- Inventor: Meng-Han Lin , Wen-Tuo Huang , Yong-Shiuan Tsair
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- The original application number of the division: US16549077 2019.08.23
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L21/8234

Abstract:
The present disclosure describes a method for forming polysilicon resistors with high-k dielectrics and polysilicon gate electrodes. The method includes depositing a resistor stack on a substrate having spaced apart first and second isolation regions. Further the method includes patterning the resistor stack to form a polysilicon resistor structure on the first isolation region and a gate structure between the first and second isolation regions, and doping the polysilicon resistor structure to form a doped layer in the polysilicon layer of the polysilicon resistor structure and source-drain regions in the substrate adjacent to the gate structure. Also, the method includes replacing the polysilicon layer in the gate structure with a metal gate electrode to form a transistor structure.
Public/Granted literature
- US20220359497A1 POLYSILICON RESISTOR STRUCTURES Public/Granted day:2022-11-10
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