Invention Grant
- Patent Title: Semiconductor device structure and methods of forming the same
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Application No.: US17475665Application Date: 2021-09-15
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Publication No.: US11869892B2Publication Date: 2024-01-09
- Inventor: Jhon Jhy Liaw
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: NZ CARR LAW OFFICE
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L29/417 ; H01L29/66 ; H01L21/8234 ; H01L29/78

Abstract:
A semiconductor device structure, along with methods of forming such, are described. The semiconductor device structure includes a first P-type metal oxide semiconductor field effect transistor (p-MOSFET) having a first fin extending along a first direction and comprising a first semiconductor layer, wherein the first fin comprises a first recess formed in a top of the first fin, the first recess having a bottom surface and a sidewall surface extending upwardly from the bottom surface. The semiconductor device structure also includes a first gate structure disposed in the first recess and in contact with the bottom surface and the sidewall surface, the first gate structure extending along a second direction substantially perpendicular to the first direction. The semiconductor device structure further includes a first spacer disposed on opposite sidewalls of the first gate structure and in contact with the first fin and the first gate structure.
Public/Granted literature
- US20220352162A1 SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME Public/Granted day:2022-11-03
Information query
IPC分类: