Invention Grant
- Patent Title: Solid-state imaging device and imaging apparatus
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Application No.: US18078734Application Date: 2022-12-09
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Publication No.: US11869907B2Publication Date: 2024-01-09
- Inventor: Tetsuji Yamaguchi
- Applicant: Sony Group Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY GROUP CORPORATION
- Current Assignee: SONY GROUP CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: SHERIDAN ROSS P.C.
- Priority: JP 11223856 2011.10.11
- Main IPC: H04N23/75
- IPC: H04N23/75 ; H01L27/146 ; H04N23/88 ; H04N25/11 ; H04N25/70 ; H04N25/71 ; H04N25/75 ; H04N25/711 ; H10K39/32 ; H01L31/101 ; H04N9/64

Abstract:
A solid-state imaging device and an imaging apparatus that enable provision of a solid-state imaging device having superior color separation and high sensitivity are provided. The solid-state imaging device includes a semiconductor layer in which a surface side becomes a circuit formation surface, photoelectric conversion units PD1 and PD2 of two layers or more that are stacked and formed in the semiconductor layer, and a longitudinal transistor Tr1 in which a gate electrode is formed to be embedded in the semiconductor layer from a surface of the semiconductor layer. The photoelectric conversion unit PD1 of one layer in the photoelectric conversion units of the two layers or more is formed over a portion of the gate electrode of the longitudinal transistor Tr1 embedded in the semiconductor substrate and is connected to a channel formed by the longitudinal transistor Tr1.
Public/Granted literature
- US20230154951A1 SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS Public/Granted day:2023-05-18
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