- Patent Title: Semiconductor device and method of forming the semiconductor device
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Application No.: US17402507Application Date: 2021-08-14
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Publication No.: US11869936B2Publication Date: 2024-01-09
- Inventor: Marc Adam Bergendahl , Gauri Karve , Fee Li Lie , Eric R. Miller , Robert Russell Robison , John Ryan Sporre , Sean Teehan
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Yuanmin Cai
- The original application number of the division: US15859362 2017.12.30
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/06 ; H01L29/423 ; H01L29/66 ; H01L29/786
Abstract:
A semiconductor device includes a fin structure including a recess formed in an upper surface of the fin structure, an inner gate formed in the recess of the fin structure, and an outer gate formed outside and around the fin structure.
Public/Granted literature
- US20210376078A1 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE Public/Granted day:2021-12-02
Information query
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