Invention Grant
- Patent Title: Integration methods to fabricate internal spacers for nanowire devices
-
Application No.: US17703218Application Date: 2022-03-24
-
Publication No.: US11869939B2Publication Date: 2024-01-09
- Inventor: Seiyon Kim , Kelin J. Kuhn , Tahir Ghani , Anand S. Murthy , Mark Armstrong , Rafael Rios , Abhijit Jayant Pethe , Willy Rachmady
- Applicant: Sony Group Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Group Corporation
- Current Assignee: Sony Group Corporation
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- The original application number of the division: US13539195 2012.06.29
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/306 ; H01L21/3105 ; H01L21/3115 ; H01L29/786 ; H01L29/423 ; H01L29/78 ; H01L29/08 ; H01L29/66 ; B82Y40/00

Abstract:
A nanowire device having a plurality of internal spacers and a method for forming said internal spacers are disclosed. In an embodiment, a semiconductor device comprises a nanowire stack disposed above a substrate, the nanowire stack having a plurality of vertically-stacked nanowires, a gate structure wrapped around each of the plurality of nanowires, defining a channel region of the device, the gate structure having gate sidewalls, a pair of source/drain regions on opposite sides of the channel region; and an internal spacer on a portion of the gate sidewall between two adjacent nanowires, internal to the nanowire stack. In an embodiment, the internal spacers are formed by depositing spacer material in dimples etched adjacent to the channel region. In an embodiment, the dimples are etched through the channel region. In another embodiment, the dimples are etched through the source/drain region.
Public/Granted literature
- US20220262901A1 INTEGRATION METHODS TO FABRICATE INTERNAL SPACERS FOR NANOWIRE DEVICES Public/Granted day:2022-08-18
Information query
IPC分类: