Invention Grant
- Patent Title: Silicon carbide semiconductor device
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Application No.: US17118964Application Date: 2020-12-11
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Publication No.: US11869943B2Publication Date: 2024-01-09
- Inventor: Chien-Chung Hung , Kuo-Ting Chu , Chwan-Yin Li
- Applicant: Shanghai Hestia Power Inc.
- Applicant Address: CN Shanghai
- Assignee: SHANGHAI HESTIA POWER INC.
- Current Assignee: SHANGHAI HESTIA POWER INC.
- Current Assignee Address: CN Shanghai
- Agency: MUNCY, GEISSLER, OLDS & LOWE, PC
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L29/872 ; H01L29/06

Abstract:
A silicon carbide semiconductor device, in particular a monolithically integrated trench Metal-Oxide-Semiconductor Field-Effect Transistor with segmentally surrounded trench Schottky diode, includes a semiconductor substrate, a trench Metal-Oxide-Semiconductor Field-Effect Transistor and a trench Schottky diode. The trench Schottky diode has a perpendicularly disposed trench extending in a first horizontal direction, a metal electrode filled into the trench, and a plurality of doped regions disposed segmentally and extending in a second horizontal direction around the trench. The first horizontal direction is substantially orthogonal to the second horizontal direction, a side wall and a bottom wall of the metal electrode in the trench forms a Schottky junction, and the current flowing from the metal electrode is restricted between adjacent doped regions.
Public/Granted literature
- US20220190117A1 SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2022-06-16
Information query
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