Invention Grant
- Patent Title: Semiconductor structure and method for forming same
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Application No.: US17386474Application Date: 2021-07-27
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Publication No.: US11869952B2Publication Date: 2024-01-09
- Inventor: Kang You , Jie Bai
- Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Applicant Address: CN Hefei
- Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee Address: CN Hefei
- Agency: Cooper Legal Group, LLC
- Priority: CN 2010230470.2 2020.03.27
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L21/02 ; H01L29/08 ; H01L29/40 ; H01L29/66

Abstract:
A semiconductor structure and a method for forming the same are provided. The method includes: forming an active region on a substrate; forming at least one trench in the active region, the trench at least dividing the active region into a source region on one side of the trench and a drain region on the other side of the trench; and forming an elevated source region and an elevated drain region on the source region and the drain region respectively.
Public/Granted literature
- US20210359094A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME Public/Granted day:2021-11-18
Information query
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