Invention Grant
- Patent Title: Method for manufacturing semiconductor device
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Application No.: US17661843Application Date: 2022-05-03
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Publication No.: US11869962B2Publication Date: 2024-01-09
- Inventor: Ryu Kamibaba , Tetsuo Takahashi , Akihiko Furukawa
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP 18122257 2018.06.27
- The original application number of the division: US16225186 2018.12.19
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L29/78 ; H01L29/08 ; H01L27/06 ; H01L21/04

Abstract:
Examples of a semiconductor device includes a transistor region formed in a semiconductor substrate having a first conductivity type drift layer, and a diode region formed to be adjacent to the transistor region in the semiconductor substrate, wherein the diode region has a second conductivity type anode layer formed on the drift layer and a first conductivity type cathode layer formed on the lower side of the drift layer, and the cathode layer has an adjacent region contacting the transistor region, the adjacent region having a depth, from a lower surface of the semiconductor substrate, which becomes shallower toward the transistor region and having first conductivity type impurity concentration which decreases toward the transistor region.
Public/Granted literature
- US11901444B2 Method for manufacturing semiconductor device Public/Granted day:2024-02-13
Information query
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