Invention Grant
- Patent Title: Light-emitting diode and method of manufacturing the same, and display device
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Application No.: US16957058Application Date: 2019-06-25
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Publication No.: US11870011B2Publication Date: 2024-01-09
- Inventor: Hu Meng
- Applicant: BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing; CN Beijing
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- International Application: PCT/CN2019/092803 2019.06.25
- International Announcement: WO2020/258033A 2020.12.30
- Date entered country: 2020-06-22
- Main IPC: H01L33/44
- IPC: H01L33/44 ; H01L33/14 ; H01L33/20 ; H01L33/38 ; H01L25/16

Abstract:
A light-emitting diode includes a first semiconductor layer, a second semiconductor layer, a light-emitting layer disposed between the first semiconductor layer and the second semiconductor layer, and a barrier layer disposed on at least part of a side face of at least one of the first semiconductor layer and the second semiconductor layer. The barrier layer is configured to form a charge depletion region between the barrier layer and the at least part of the side face.
Public/Granted literature
- US20230155068A1 LIGHT-EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME, AND DISPLAY DEVICE Public/Granted day:2023-05-18
Information query
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