Invention Grant
- Patent Title: Board to board connector assembly for HF signal transmission
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Application No.: US17289643Application Date: 2019-11-12
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Publication No.: US11870168B2Publication Date: 2024-01-09
- Inventor: Florian Stemplinger , Martin Wagner
- Applicant: HUBER+SUHNER AG
- Applicant Address: CH Herisau
- Assignee: HUBER+SUHNER AG
- Current Assignee: HUBER+SUHNER AG
- Current Assignee Address: CH Herisau
- Agency: Pauley Erickson & Swanson
- Priority: CH 8918 2018.11.12 CH 4619 2019.08.22
- International Application: PCT/EP2019/080973 2019.11.12
- International Announcement: WO2020/099374A 2020.05.22
- Date entered country: 2021-04-28
- Main IPC: H01R12/70
- IPC: H01R12/70 ; H01R13/6594 ; H01R24/50 ; H01R24/54 ; H01R12/73 ; H01R24/48 ; H01R12/53 ; H01R12/51 ; H01R12/91 ; H01R103/00 ; H01R13/6591 ; H01R13/6592 ; H01R24/40

Abstract:
A board to board connector assembly (1) includes a first connector (2) suitable to be arranged on a first printed circuit board (3) and a second connector (4) suitable to be arranged on a second printed circuit board (5). An adapter (6) is arranged in a mounted position between and interconnected to the first and the second connector (2, 4). The adapter (6) includes an adapter inner conductor (7) and an adapter outer conductor (8). The adapter outer conductor (8) is arranged separate from the adapter inner conductor (7) and comprises a bore (18) in which the adapter inner conductor (7) is arranged.
Public/Granted literature
- US20210399447A1 BOARD TO BOARD CONNECTOR ASSEMBLY FOR HF SIGNAL TRANSMISSION Public/Granted day:2021-12-23
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