Invention Grant
- Patent Title: Backing plate for mounting and sealing an electrical connector to an intermediate surface
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Application No.: US17504899Application Date: 2021-10-19
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Publication No.: US11870178B2Publication Date: 2024-01-09
- Inventor: Nicholas A. Durse , Adam Wolfgang
- Applicant: Aptiv Technologies AG
- Applicant Address: CH Schaffhausen
- Assignee: Aptiv Technologies AG
- Current Assignee: Aptiv Technologies AG
- Current Assignee Address: CH Schaffhausen
- Agency: Billion & Armitage
- Main IPC: H01R13/40
- IPC: H01R13/40 ; H01R13/52 ; H01R13/512

Abstract:
A backing plate, a corresponding electrical connector for mating with the backing plate, an electrical header, and an assembly thereof are described herein. The backing plate has an inner portion having a first thickness and an outer portion having a second thickness that is greater than the first thickness. The outer portion surrounds a perimeter of the inner portion and forms a cavity within the backing plate for acceptance of the electrical header. The backing plate also contains a connector attachment portion configured to attach the backing plate to the electrical connector and an intermediate surface attachment portion configured to attach the backing plate to the intermediate surface.
Public/Granted literature
- US20220037829A1 BACKING PLATE FOR MOUNTING AND SEALING AN ELECTRICAL CONNECTOR TO AN INTERMEDIATE SURFACE Public/Granted day:2022-02-03
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