Invention Grant
- Patent Title: Shaped contact
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Application No.: US17704594Application Date: 2022-03-25
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Publication No.: US11870194B2Publication Date: 2024-01-09
- Inventor: Jianchou (Jackson) Chen , YuQiang (Thomas) Zhao , Hongbo (Noah) Zhou , Wei Yao , Zhiwei (Will) Liu , Binglin (Aaron) Feng
- Applicant: Tyco Electronics (Shanghai) Co. Ltd , Tyco Electronics (Dongguan) Ltd.
- Applicant Address: CN Shanghai
- Assignee: Tyco Electronics (Shanghai) Co., Ltd.,Tyco Electronics (Dongguan) Ltd.
- Current Assignee: Tyco Electronics (Shanghai) Co., Ltd.,Tyco Electronics (Dongguan) Ltd.
- Current Assignee Address: CN Shanghai; CN Dongguan
- Agency: Barley Snyder
- Priority: CN 2110323246.2 2021.03.25
- Main IPC: H01R4/18
- IPC: H01R4/18 ; H01R13/11

Abstract:
A flag shape contact includes a substrate, and a plug-in structure for receiving a mating contact. The plug-in structure extends from the substrate in a first direction. A riveting structure is provided for riveting or connecting a wire conductor to the contact. The riveting structure extends from the substrate in a second direction, distinct from the first direction. The riveting structure is disposed outside an extension area of the plug-in structure in the first direction.
Public/Granted literature
- US20220311150A1 Shaped Contact Public/Granted day:2022-09-29
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