Invention Grant
- Patent Title: Solid-state power amplifiers with cooling capabilities
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Application No.: US17009851Application Date: 2020-09-02
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Publication No.: US11870202B2Publication Date: 2024-01-09
- Inventor: Rajesh Kumar Putti , Vinodh Ramachandran , Ananthkrishna Jupudi , Lean Wui Koh , Prashant Agarwal
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: MOSER TABOADA
- Main IPC: H03F1/52
- IPC: H03F1/52 ; H01S3/041 ; H01S3/067 ; H01S3/042 ; H01S3/23

Abstract:
Methods and apparatus for processing a substrate. For example, a processing chamber can include a power source, an amplifier connected to the power source, comprising at least one of a gallium nitride (GaN) transistor or a gallium arsenide (GaAs) transistor, and configured to amplify a power level of an input signal received from the power source to heat a substrate in a process volume, and a cooling plate configured to receive a coolant to cool the amplifier during operation.
Public/Granted literature
- US20220069536A1 SOLID-STATE POWER AMPLIFIERS WITH COOLING CAPABILITIES Public/Granted day:2022-03-03
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