Invention Grant
- Patent Title: Apparatus and methods for manufacturing high-density coil with formed cooling channels
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Application No.: US17157396Application Date: 2021-01-25
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Publication No.: US11870311B2Publication Date: 2024-01-09
- Inventor: Ian Patrick Brown
- Applicant: Ian Patrick Brown
- Applicant Address: US IL Evanston
- Assignee: ILLINOIS INSTITUTE OF TECHNOLOGY
- Current Assignee: ILLINOIS INSTITUTE OF TECHNOLOGY
- Current Assignee Address: US IL Chicago
- Agency: Pauley Erickson & Swanson
- Main IPC: H02K3/28
- IPC: H02K3/28 ; H02K3/24 ; H02K15/00 ; H02K1/20
Abstract:
A conductive coil for an electric application having a cooling channel for a coolant liquid or gas. The coil includes a wire winding of a plurality of wire turns. The wire winding is compressed about a cooling channel which is disposed between adjacent turn segments of the plurality of wire turns. The wire winding is formed and pressed against a shaping element to form the coolant channel within the compressed winding.
Public/Granted literature
- US20210234424A1 APPARATUS AND METHODS FOR MANUFACTURING HIGH-DENSITY COIL WITH FORMED COOLING CHANNELS Public/Granted day:2021-07-29
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