Invention Grant
- Patent Title: Radio frequency module and associated method with envelope tracking power supply
-
Application No.: US17674985Application Date: 2022-02-18
-
Publication No.: US11870397B2Publication Date: 2024-01-09
- Inventor: Shi-Wen Liu , Tang-Nian Luo , Chi-Tsan Chen , Chi-Kun Chiu , Jiann-Huang Liu , Peng-Ta Huang , Chi-Sheng Yu , Hua-Shan Chou
- Applicant: MEDIATEK Inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H03F1/02
- IPC: H03F1/02 ; H03F3/24 ; H04B7/06

Abstract:
The invention provides a radio frequency (RF) module and associated method with envelope tracking (ET) power supply in a device. The RF module may comprise a plurality of transmitters, an ET output, and an ET multiplexer. Each said transmitter may comprise an ET port and one or more RF outputs, and may be configured for providing an RF signal to one of said one or more RF outputs, and providing an ET signal, which reflects an envelope of the RF signal, to the ET port. The ET multiplexer may be coupled between said ET ports of the plurality of transmitters and the ET output, for selectively relaying one of said ET ports to the ET output.
Public/Granted literature
- US20230268887A1 RADIO FREQUENCY MODULE AND ASSOCIATED METHOD WITH ENVELOPE TRACKING POWER SUPPLY Public/Granted day:2023-08-24
Information query
IPC分类: