An electronic device includes a first substrate and a second substrate, a first metal plate, and a second metal plate. On each of the first substrate and the second substrate, an electronic component is mounted. The first substrate and the second substrate are positioned toward a stacking direction with respective main surfaces facing each other. The first metal plate includes a flat portion that is interposed between the first substrate and the second substrate and that directly or indirectly abuts the electronic component mounted on the first substrate and the electronic component mounted on the second substrate, and a first shield portion that covers a portion of the side surface of the first substrate. The second metal plate includes a second shield portion that covers the entire circumference of the side surface of the second substrate and the side surface of the first substrate exposed from the first metal plate. The first metal plate and the second metal plate abut each other directly or indirectly.