Invention Grant
- Patent Title: Earpiece cover
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Application No.: US18063748Application Date: 2022-12-09
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Publication No.: US11871175B2Publication Date: 2024-01-09
- Inventor: Jini Peang
- Applicant: Jini Peang
- Applicant Address: US NY Brooklyn
- Assignee: Jini Peang
- Current Assignee: Jini Peang
- Current Assignee Address: US NY Brooklyn
- Agency: Tatonetti IP
- Main IPC: H04R1/10
- IPC: H04R1/10

Abstract:
An earbud cover is implemented that secures to an earbud and protects at least the earbud's exterior surface from external damage. The earbud cover includes an upper body portion that conforms to the shape of the earbud's bulky body, a mid-section that conforms to the shape of the earbud's thinner body, and a bottom portion underneath a bottom surface of the earbud. While the upper body portion, mid-section, and bottom portion have been used to describe the earbud, other characterizations of the earbud's design are also possible. The earbud includes a cutout/opening corresponding to the earbud's I/O interface, such as its speaker or microphone. While a single cutout/opening is shown in the pictures, multiple openings may be utilized depending on the specific earbud. The bottom portion of the earbud also includes a hole that may be used to carry around the covers more easily, such as on a keychain.
Public/Granted literature
- US20230319455A1 Earpiece Cover Public/Granted day:2023-10-05
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