Invention Grant
- Patent Title: Printed circuit board including coaxial plated through hole and electronic apparatus including same in wireless communication system
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Application No.: US17957316Application Date: 2022-09-30
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Publication No.: US11871516B2Publication Date: 2024-01-09
- Inventor: Kwanghyun Baek , Juneseok Lee , Dohyuk Ha , Youngju Lee , Jinsu Heo
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H04M1/02 ; H05K1/02

Abstract:
The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An electronic apparatus is provided. The electronic apparatus includes a printed circuit board (PCB), an antenna module mounted on a surface of the printed circuit board, and a radio frequency integrated circuit (RFIC) module mounted on another surface of the printed circuit. The printed circuit board includes a coaxial plated through-hole (PTH) electrically connected with the antenna module and the RFIC.
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