Invention Grant
- Patent Title: Method for producing a printed wiring board
-
Application No.: US16995507Application Date: 2020-08-17
-
Publication No.: US11871520B2Publication Date: 2024-01-09
- Inventor: Michael Knox , Andrew Ippoliti , Georgios Kyriakou , Carlos Ospina , Nicolas Vansnick
- Applicant: BOTFACTORY INC.
- Applicant Address: US NY Long Island City
- Assignee: BOTFACTORY INC.
- Current Assignee: BOTFACTORY INC.
- Current Assignee Address: US NY Long Island City
- Agency: Law Office of Herbert F. Ruschmann
- Agent Herbert F. Ruschmann
- The original application number of the division: US14392408
- Main IPC: H01R31/00
- IPC: H01R31/00 ; H05K13/04 ; H05K3/12 ; H05K3/46 ; H05K3/34

Abstract:
A method for producing a printed circuit board on a substrate uses control data derived from a circuit schematic, CAD file, Gerber file or files or equivalents, to operates a function head configured to effect printing conductive and non-conductive materials on the substrate and produces control data to effect the circuit printing. The method optionally uses a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of the PCB multilayer circuit board files to printing data files for controlling the function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of the multilayer circuit board layout data.
Public/Granted literature
- US20200383250A1 METHOD FOR PRODUCING A PRINTED WIRING BOARD Public/Granted day:2020-12-03
Information query