Invention Grant
- Patent Title: Component mounting machine
-
Application No.: US17770524Application Date: 2019-10-25
-
Publication No.: US11871522B2Publication Date: 2024-01-09
- Inventor: Shingo Fujimura , Kenji Watanabe
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2019/042011 2019.10.25
- International Announcement: WO2021/079512A 2021.04.29
- Date entered country: 2022-04-20
- Main IPC: H05K13/08
- IPC: H05K13/08 ; H05K13/04

Abstract:
A control device configured to control a component pickup and mounting operation of a component mounting machine; and multiple devices configured to execute the component pickup and mounting operation are provided. A device out of the multiple devices is attachably and detachably attached to the component mounting machine and includes a field programmable gate array that operates each function of the device by communicating with the control device. The field programmable gate array has a clock gating function of reducing an electric current flowing into the attachable and detachable device by stopping processing on a function that is not used, out of individual functions of the attachable and detachable device, when the attachable and detachable device is in a state capable of being removed by an operator.
Public/Granted literature
- US20220408623A1 COMPONENT MOUNTING MACHINE Public/Granted day:2022-12-22
Information query