Invention Grant
- Patent Title: Electronic component module and method for manufacturing electronic component module
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Application No.: US17662687Application Date: 2022-05-10
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Publication No.: US11871523B2Publication Date: 2024-01-09
- Inventor: Ryohei Okabe , Toru Komatsu
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP 19229956 2019.12.20
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/28 ; H01L23/28 ; H05K9/00
Abstract:
An electronic component module includes a substrate, an electronic component, an insulating resin, and a shield film. The insulating resin covers a first main surface side of the substrate. The insulating resin exposes an opposite surface of the electronic component. The shield film covers the insulating resin and the opposite surface of the electronic component. The opposite surface has an uneven portion. A concave portion of the uneven portion has a smoother shape than a convex portion of the uneven portion.
Public/Granted literature
- US20220264748A1 ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE Public/Granted day:2022-08-18
Information query
