Invention Grant
- Patent Title: Two phase system for enclosure systems
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Application No.: US17465122Application Date: 2021-09-02
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Publication No.: US11871547B2Publication Date: 2024-01-09
- Inventor: Tianyi Gao
- Applicant: Baidu USA LLC
- Applicant Address: US CA Sunnyvale
- Assignee: BAIDU USA LLC
- Current Assignee: BAIDU USA LLC
- Current Assignee Address: US CA Sunnyvale
- Agency: WOMBLE BOND DICKINSON (US) LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G01M3/02

Abstract:
A coolant management unit includes a server supply manifold, a server return manifold, a power distribution, and a controller. A server supply manifold is to receive cooling fluid from a cooling fluid source. The server supply manifold is to distribute the cooling fluid to server blades. The server return manifold is to receive vapor from the one or more server blades. The cooling fluid is two-phase cooling fluid to extract heat from one or more servers and to evaporate into the vapor into the server return manifold, and the vapor is transmitted to an external condenser via the rack return manifold to be condensed back to a liquid form. A power distribution bus is configured to distribute power to the one or more servers. A controller is configured to control a fluid pump coupled to the server supply manifold based on one or more signals received from different sensors.
Public/Granted literature
- US20230065556A1 TWO PHASE SYSTEM FOR ENCLOSURE SYSTEMS Public/Granted day:2023-03-02
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