Invention Grant
- Patent Title: Heat conduction mechanism
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Application No.: US17608941Application Date: 2020-05-08
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Publication No.: US11871549B2Publication Date: 2024-01-09
- Inventor: Hiroto Yamada
- Applicant: SONY GROUP CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY GROUP CORPORATION
- Current Assignee: SONY GROUP CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: CHIP LAW GROUP
- Priority: JP 19093092 2019.05.16
- International Application: PCT/JP2020/018739 2020.05.08
- International Announcement: WO2020/230745A 2020.11.19
- Date entered country: 2021-11-04
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; G06F1/16 ; H04N23/52

Abstract:
Provided is a heat conduction mechanism including: a first member including at least one heat source; a second member including a heat dissipation element, the second member displaceable with respect to the first member; and a heat conductive sheet that transfers heat of the heat source to the heat dissipation element, in which a protective sheet is provided to a portion of the heat conductive sheet that can be in contact with at least a part of the first member or the second member.
Public/Granted literature
- US20220256745A1 HEAT CONDUCTION MECHANISM Public/Granted day:2022-08-11
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