Invention Grant
- Patent Title: Method for forming storage node contact structure and semiconductor structure
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Application No.: US17522281Application Date: 2021-11-09
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Publication No.: US11871562B2Publication Date: 2024-01-09
- Inventor: Erxuan Ping , Zhen Zhou , Lingguo Zhang , Weiping Bai
- Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Applicant Address: CN Hefei
- Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee Address: CN Hefei
- Agency: Cooper Legal Group, LLC
- Priority: CN 2011605353.6 2020.12.30
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H10B12/00 ; G11C5/06

Abstract:
A method for forming a storage node contact structure and semiconductor structure are provided. The method includes providing a substrate having a surface on which bit line structures are formed; forming a groove at a part, corresponding to an active region, of bottom of the contact hole; and growing a silicon crystal from the groove in the contact hole by using an epitaxial growth process, and controlling growth rates of the silicon crystal in a first and second directions in a growth process to enable the growth rate of the silicon crystal in the first direction to be greater than the growth rate of the silicon crystal in the second direction at beginning of growth and enable the growth rate of the silicon crystal in the first direction to be equal to the growth rate of the silicon crystal in the second direction at end of the growth.
Public/Granted literature
- US20220208772A1 METHOD FOR FORMING STORAGE NODE CONTACT STRUCTURE AND SEMICONDUCTOR STRUCTURE Public/Granted day:2022-06-30
Information query
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