Invention Grant
- Patent Title: Assembly of piezoelectric material substrate and supporting substrate, and method for manufacturing same
-
Application No.: US16934460Application Date: 2020-07-21
-
Publication No.: US11871671B2Publication Date: 2024-01-09
- Inventor: Yuji Hori , Takahiro Yamadera , Tatsuro Takagaki
- Applicant: NGK INSULATORS, LTD.
- Applicant Address: JP Nagoya
- Assignee: NGK INSULATORS, LTD.
- Current Assignee: NGK INSULATORS, LTD.
- Current Assignee Address: JP Nagoya
- Agency: FLYNN THIEL, P.C.
- Priority: JP 18007912 2018.01.22
- Main IPC: H10N30/072
- IPC: H10N30/072 ; H10N30/086 ; H10N30/853

Abstract:
A bonded body includes a supporting substrate, a silicon oxide layer provided on the supporting substrate, and a piezoelectric material substrate provided on the silicon oxide layer and composed of a material selected from the group consisting of lithium niobate, lithium tantalate and lithium niobate-lithium tantalate. The surface resistivity of the piezoelectric material substrate on the side of the silicon oxide layer is 1.7×101 5Ω/□ or higher.
Public/Granted literature
- US20210265558A9 ASSEMBLY OF PIEZOELECTRIC MATERIAL SUBSTRATE AND SUPPORTING SUBSTRATE, AND METHOD FOR MANUFACTURING SAME Public/Granted day:2021-08-26
Information query