Invention Grant
- Patent Title: Tool pack assembly
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Application No.: US17118997Application Date: 2020-12-11
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Publication No.: US11883870B2Publication Date: 2024-01-30
- Inventor: Rick Swedberg
- Applicant: Pride Engineering, LLC
- Applicant Address: US MN Minneapolis
- Assignee: Pride Engineering, LLC
- Current Assignee: Pride Engineering, LLC
- Current Assignee Address: US MN Minneapolis
- Agency: Eggink & Eggink
- Agent Anthony G. Eggink; Katrina M. Eggink
- The original application number of the division: US15352055 2016.11.15
- Main IPC: G01L5/00
- IPC: G01L5/00 ; B21C51/00 ; G01L1/22 ; G01L5/1627 ; B21D22/28 ; B21D51/26

Abstract:
A tool pack assembly having sensor plates to measure the temperature of a tool pack forming die and the forces exerted on the forming dies during can production. Each sensor plate may include at least one temperature sensor and at least one strain sensor for reading and transmitting temperature and strain data relating to the dies of a tool pack assembly. The data read and transmitted may be used to determine the concentricity of the punch of a tool pack assembly during operation making can bodies.
Public/Granted literature
- US20210094083A1 Tool Pack Assembly Public/Granted day:2021-04-01
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