Invention Grant
- Patent Title: Polishing pad and method for manufacturing same
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Application No.: US17040638Application Date: 2019-03-19
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Publication No.: US11883925B2Publication Date: 2024-01-30
- Inventor: Ryuma Matsuoka , Hiroshi Kurihara , Satsuki Narushima , Yamato Takamizawa
- Applicant: Fujibo Holdings, Inc.
- Applicant Address: JP Tokyo
- Assignee: FUJIBO HOLDINGS, INC.
- Current Assignee: FUJIBO HOLDINGS, INC.
- Current Assignee Address: JP Tokyo
- Agency: BUCHANAN INGERSOLL & ROONEY PC
- Priority: JP 18066808 2018.03.30
- International Application: PCT/JP2019/011405 2019.03.19
- International Announcement: WO2019/188577A 2019.10.03
- Date entered country: 2020-09-23
- Main IPC: B24B37/24
- IPC: B24B37/24

Abstract:
A polishing pad is equipped with a polishing layer having a polyurethane sheet, wherein a tan δ peak value change rate determined by formula: tan δ peak value change rate=|tan δ peakwet−tan δ peakdry|/tan δ peakdry×100, is not more than 15%, where tan δ peakwet represents the peak value of the loss tangent tan δ, of the polyurethane sheet in a wet state after being immersed in water for three days, within a temperature range of 20-100° C. in a tensile mode under an initial load of 148 g with a strain range of 0.1% at a measurement frequency of 1.6 Hz, and tan δ peakdry represents the peak value of the loss tangent tan δ, of the polyurethane sheet in a dry state without being immersed in water, within a temperature range of 20-100° C. in a tensile mode under an initial load of 148 g with a strain range of 0.1% at a measurement frequency of 1.6 Hz.
Public/Granted literature
- US20210114166A1 POLISHING PAD AND METHOD FOR MANUFACTURING SAME Public/Granted day:2021-04-22
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