Invention Grant
- Patent Title: Insulating sheet and laminate
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Application No.: US16611094Application Date: 2018-05-09
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Publication No.: US11884039B2Publication Date: 2024-01-30
- Inventor: Masataka Sugimoto , Keigo Oowashi , Kouji Ashiba , Yuko Kawahara
- Applicant: SEKISUI CHEMICAL CO., LTD.
- Applicant Address: JP Osaka
- Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Cheng Law Group, PLLC
- Priority: JP 17094256 2017.05.10
- International Application: PCT/JP2018/017932 2018.05.09
- International Announcement: WO2018/207819A 2018.11.15
- Date entered country: 2019-11-05
- Main IPC: B32B27/20
- IPC: B32B27/20 ; B32B27/18 ; C08K3/38

Abstract:
Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness. The insulating sheet according to the present invention contains a thermosetting component and a thermally conductive filler, the thermally conductive filler contains boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first content of the boron nitride in 100% by volume of a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second content of the boron nitride in 100% by volume of a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.
Information query