Invention Grant
- Patent Title: Void fill packaging
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Application No.: US17461219Application Date: 2021-08-30
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Publication No.: US11884470B2Publication Date: 2024-01-30
- Inventor: Christopher Brewster , Allan Guillen , Renato Yutuc
- Applicant: PPC Industries Inc.
- Applicant Address: US WI Pleasant Prairie
- Assignee: PPC Industries Inc.
- Current Assignee: PPC Industries Inc.
- Current Assignee Address: US WI Pleasant Prairie
- Agency: Nelson Mullins Riley & Scarborough LLP
- Main IPC: B65D81/03
- IPC: B65D81/03 ; B29C48/08 ; B29C48/10 ; B29C48/00 ; B29L31/00
Abstract:
A void-fill package, and method of making the same, comprising at least 50%, on a weight basis of the package, recycled polyethylene; at least 40%, on a weight basis of the package, virgin polyethylene; at least one moisture scavenger; and at least one melt stabilizer.
Public/Granted literature
- US20230065752A1 VOID FILL PACKAGING Public/Granted day:2023-03-02
Information query
