Invention Grant
- Patent Title: Device, package structure and manufacturing method of device
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Application No.: US17842810Application Date: 2022-06-17
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Publication No.: US11884535B2Publication Date: 2024-01-30
- Inventor: Jemm Yue Liang , Chiung C. Lo , Martin George Lim , Wen-Chien Chen , Michael David Housholder , David Hong
- Applicant: xMEMS Labs, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: xMEMS Labs, Inc.
- Current Assignee: xMEMS Labs, Inc.
- Current Assignee Address: US CA Santa Clara
- Agent Winston Hsu
- Main IPC: B81B3/00
- IPC: B81B3/00 ; H04R31/00

Abstract:
A package structure includes a first substrate and a first device disposed on the first substrate. The first device includes at least one anchor structure, a film structure anchored by the anchor structure and an actuator configured to control the film structure to form a first vent temporarily. The film structure partitions a space into a first volume to be connected to an ear canal and a second volume connected to an ambient of a wearable sound device. The ear canal and the ambient are connected via the first vent when the first vent is opened. The first vent is opened by controlling a first membrane portion and a second membrane portion of the film structure, such that a difference between a first displacement of the first membrane portion and a second displacement of the second membrane portion is larger than a thickness of the film structure.
Public/Granted literature
- US20220315412A1 DEVICE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF DEVICE Public/Granted day:2022-10-06
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