Invention Grant
- Patent Title: Sealant and sealant composition for electrochemical device
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Application No.: US17593393Application Date: 2020-03-05
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Publication No.: US11884805B2Publication Date: 2024-01-30
- Inventor: Kouichirou Maeda
- Applicant: ZEON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ZEON CORPORATION
- Current Assignee: ZEON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: KENJA IP LAW PC
- Priority: JP 19053513 2019.03.20
- International Application: PCT/JP2020/009434 2020.03.05
- International Announcement: WO2020/189306A 2020.09.24
- Date entered country: 2021-09-17
- Main IPC: C08L23/22
- IPC: C08L23/22 ; H01M50/193 ; C09K3/10 ; H01M50/184

Abstract:
A sealant for an electrochemical device contains (A) a polyisobutylene polymer and (B) a conjugated diene polymer. The sealant contains the (A) polyisobutylene polymer in a proportion of more than 60 mass % and not more than 98 mass % and the (B) conjugated diene polymer in a proportion of not less than 2 mass % and less than 40 mass % relative to the total mass of the (A) polyisobutylene polymer and the (B) conjugated diene polymer.
Public/Granted literature
- US20220186013A1 SEALANT AND SEALANT COMPOSITION FOR ELECTROCHEMICAL DEVICE Public/Granted day:2022-06-16
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