Invention Grant
- Patent Title: Thermoplastic resin composition and molded article including the same
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Application No.: US17298523Application Date: 2020-08-25
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Publication No.: US11884810B2Publication Date: 2024-01-30
- Inventor: Da Eun Sung , Tae Hoon Kim , Chun Ho Park , Yong Hee An , Wangrae Cho , Ho Hoon Kim , Jeongmin Jang
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Priority: KR 20190110417 2019.09.06 KR 20200106135 2020.08.24
- International Application: PCT/KR2020/011328 2020.08.25
- International Announcement: WO2021/045429A 2021.03.11
- Date entered country: 2021-05-28
- Main IPC: C08L51/00
- IPC: C08L51/00 ; C08L25/12 ; C08L25/14 ; C08L33/12 ; C08L77/06

Abstract:
The present invention relates to a thermoplastic resin composition and a molded article including the same. More specifically, the thermoplastic resin composition of the present invention includes 100 parts by weight of a base resin consisting of 10 to 30% by weight of an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A-1) including an acrylate rubber having an average particle diameter of 0.05 to 0.15 μm, 20 to 40% by weight of an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A-2) including an acrylate rubber having an average particle diameter of 0.3 to 0.5 μm, 0 to 35% by weight of an aromatic vinyl polymer (B), and 10 to 60% by weight of a polymethacrylate (C); and 0.5 to 10 parts by weight of a polyamide (D).
Public/Granted literature
- US20220010122A1 THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE INCLUDING THE SAME Public/Granted day:2022-01-13
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