This silicone gel composition contains



(A) an organopolysiloxane having one or more silicon atom-bonded alkenyl groups per molecule,
(B) an organohydrogen polysiloxane having two or more silicon atom-bonded hydrogen atoms per molecule,
(C) a platinum group metal-based curing catalyst,
(D) an isocyanuric acid derivative having two trialkoxysilyl groups and one crosslinkable vinyl group and/or an isocyanuric acid derivative having three trialkoxysilyl groups, and
(E) a ketenesilylacetal-type compound, and provides a cured product having a specific penetration.




The silicone gel composition can provide a silicone gel cured product that is a silicone gel having excellent heat resistance and adhesiveness to metals at high temperature and having a high penetration, that is capable of maintaining a low elastic modulus and a low stress even in use at high temperature for long periods of time, and that enables reduction of the occurrence of bubbles and reduction of deterioration in releasability from a substrate and in electrical insulating properties.