Invention Grant
- Patent Title: Refrigerant vapor compression system
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Application No.: US17253452Application Date: 2020-05-12
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Publication No.: US11885533B2Publication Date: 2024-01-30
- Inventor: Jianhua Zhou , Tobias H. Sienel , KeonWoo Lee , Jason D. Scarcella , Douglas Auyer , Ping Sue Vang , Bruce J. Poplawski
- Applicant: Carrier Corporation
- Applicant Address: US FL Palm Beach Gardens
- Assignee: Carrier Corporation
- Current Assignee: Carrier Corporation
- Current Assignee Address: US FL Palm Beach Gardens
- Agency: Carlson, Gaskey & Olds, P.C.
- International Application: PCT/US2020/032439 2020.05.12
- International Announcement: WO2020/247153A 2020.12.10
- Date entered country: 2020-12-17
- Main IPC: F25B1/10
- IPC: F25B1/10 ; F25B6/04 ; F25B41/39 ; F25B9/00

Abstract:
A refrigerant vapor compression system includes a compression device having at least a first compression stage and a second compression stage arranged in series refrigerant flow relationship. A first refrigerant heat rejection heat exchanger is disposed downstream with respect to refrigerant flow of the second compression stage. A first refrigerant intercooler is disposed intermediate the first compression stage and the second compression stage. The first refrigerant intercooler is disposed downstream of the first refrigerant heat rejection heat exchanger with respect to the flow of the first secondary fluid. An economizer includes a vapor line in fluid communication with a suction inlet to the second compression stage. A second refrigerant heat rejection heat exchanger is disposed intermediate with respect to refrigerant flow of the second compression stage and the first refrigerant heat rejection heat exchanger. A second refrigerant intercooler is disposed intermediate the first compression stage and the second compression.
Public/Granted literature
- US20210247109A1 REFRIGERANT VAPOR COMPRESSION SYSTEM Public/Granted day:2021-08-12
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