- Patent Title: Method for measuring heat dissipation of electromechanical device
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Application No.: US17578783Application Date: 2022-01-19
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Publication No.: US11885693B2Publication Date: 2024-01-30
- Inventor: Yulong Ji , Chuang Liu , Hailang Kuang
- Applicant: DALIAN MARITIME UNIVERSITY
- Applicant Address: CN Liaoning
- Assignee: DALIAN MARITIME UNIVERSITY
- Current Assignee: DALIAN MARITIME UNIVERSITY
- Current Assignee Address: CN Liaoning
- Agency: NKL Law
- Agent Allen Xue
- Priority: CN 1910656645.3 2019.07.19 CN 1921141609.5 2019.07.19
- Main IPC: G01K17/20
- IPC: G01K17/20 ; G01N25/18

Abstract:
A method for measuring heat dissipation of electromechanical device includes: S1. establishing a measuring apparatus; S2. measuring and obtaining data: a mass flow m corresponding to each cooling medium flowing through a housing, a temperature T1 of a liquid inlet, a temperature T2 of a liquid outlet, a temperature T3 of an air inlet, a temperature T4 of an air outlet, a temperature T5 of the inside wall of the housing, a temperature T6 of the outside wall of the housing, a total area A of the inside wall of the housing, and a wall thickness L of the housing are measured by the measuring elements; S3. calculating the heat dissipation. The heat dissipation of the electromechanical device under a working condition is measured so as to provide a reference for the heat dissipation design of electromechanical device.
Public/Granted literature
- US20220136912A1 METHOD FOR MEASURING HEAT DISSIPATION OF ELECTROMECHANICAL DEVICE Public/Granted day:2022-05-05
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