Invention Grant
- Patent Title: Sensor, stack-type sensor, and electronic device
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Application No.: US17277431Application Date: 2019-10-03
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Publication No.: US11885695B2Publication Date: 2024-01-30
- Inventor: Tomoko Katsuhara , Yoshiaki Sakakura , Manami Miyawaki
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JP 18197381 2018.10.19
- International Application: PCT/JP2019/039155 2019.10.03
- International Announcement: WO2020/080127A 2020.04.23
- Date entered country: 2021-03-18
- Main IPC: G01L1/14
- IPC: G01L1/14

Abstract:
A sensor includes a sensor electrode layer including a capacitive sensing unit, a first reference electrode layer provided to face a first surface of the sensor electrode layer, and a first elastic layer that is provided between the first reference electrode layer and the sensor electrode layer, and is configured to be elastically deformed by shear force added in an in-plane direction. At least one of the first reference electrode layer or the first elastic layer includes a first probe portion that is displaced in an in-plane direction in accordance with elastic deformation of the first elastic layer, and changes an electrostatic capacitance of the sensing unit.
Public/Granted literature
- US20220034728A1 SENSOR, STACK-TYPE SENSOR, AND ELECTRONIC DEVICE Public/Granted day:2022-02-03
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