Invention Grant
- Patent Title: Circuit board, circuit board jointed panel, periscope camera module, and application thereof
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Application No.: US17295652Application Date: 2019-10-25
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Publication No.: US11885955B2Publication Date: 2024-01-30
- Inventor: Yinbo Zhang
- Applicant: NINGBO SUNNY OPOTECH CO., LTD.
- Applicant Address: CN Zhejiang
- Assignee: NINGBO SUNNY OPOTECH CO., LTD.
- Current Assignee: NINGBO SUNNY OPOTECH CO., LTD.
- Current Assignee Address: CN Zhejiang
- Agency: WENDEROTH, LIND & PONACK, L.L.P.
- Priority: CN 1811397359.1 2018.11.22 CN 1821934729.6 2018.11.22
- International Application: PCT/CN2019/113353 2019.10.25
- International Announcement: WO2020/103644A 2020.05.28
- Date entered country: 2021-05-20
- Main IPC: G02B23/24
- IPC: G02B23/24 ; G06F1/16 ; H05K1/14
Abstract:
A circuit board includes a flexible circuit board layer, a rigid circuit board layer, a chip connection portion, and a bending portion. The chip connection portion includes at least part of the flexible circuit board layer and at least part of the rigid circuit board layer overlapping the flexible circuit board layer. The bending portion includes at least part of the flexible circuit board layer and at least part of the rigid circuit board layer overlapping the flexible circuit board layer. The bending portion is connected to the chip connection portion in an invertible manner, after the bending portion is inverted to the rear side of the chip connection portion, a part of the flexible circuit board layer of the bending portion and a part of the flexible circuit board layer of the chip connection portion are arranged face-to-face.
Public/Granted literature
- US20220011565A1 CIRCUIT BOARD, CIRCUIT BOARD JOINTED PANEL, PERISCOPE CAMERA MODULE, AND APPLICATION THEREOF Public/Granted day:2022-01-13
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