Invention Grant
- Patent Title: Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device
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Application No.: US17002911Application Date: 2020-08-26
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Publication No.: US11886113B2Publication Date: 2024-01-30
- Inventor: Keita Kato , Michihiro Shirakawa , Akiyoshi Goto , Takashi Kawashima , Masafumi Kojima
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP 18036843 2018.03.01
- Main IPC: G03F7/004
- IPC: G03F7/004 ; C07C381/12 ; C07D295/26 ; C07D327/08 ; C07D333/46 ; C08L25/06 ; C08L33/06 ; C08L33/08 ; C08L33/16 ; G03F7/115 ; G03F7/20

Abstract:
The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition with which a pattern having an excellent pattern collapse suppressing property and excellent LWR performance can be obtained. In addition, the present invention also provides a resist film, a pattern forming method, and a method for manufacturing an electronic device, each regarding the actinic ray-sensitive or radiation-sensitive resin composition. The actinic ray-sensitive or radiation-sensitive resin composition of the present invention includes a resin whose solubility in a developer is changed by the action of an acid, a photoacid generator represented by General Formula (b1), and a solvent, in which the photoacid generator represented by General Formula (b1) is a compound that generates an acid having a pka of 1.0 or less upon irradiation with actinic rays or radiation
Information query
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