A photosensitive insulating paste according to preferred embodiments of the present disclosure contains glass frit, a first inorganic filler, a second inorganic filler, an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, and a solvent. The first inorganic filler has a refractive index of 1.7 or higher. The second inorganic filler has a refractive index of 1.55 or lower. An electronic component according to preferred embodiments of the present disclosure is produced by using the photosensitive insulating paste.