Invention Grant
- Patent Title: Material for forming underlayer film, resist underlayer film, method of producing resist underlayer film, and laminate
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Application No.: US18168261Application Date: 2023-02-13
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Publication No.: US11886119B2Publication Date: 2024-01-30
- Inventor: Koji Inoue , Takashi Oda , Keisuke Kawashima
- Applicant: MITSUI CHEMICALS, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUI CHEMICALS, INC.
- Current Assignee: MITSUI CHEMICALS, INC.
- Current Assignee Address: JP Tokyo
- Agency: BUCHANAN INGERSOLL & ROONEY PC
- Priority: JP 17108506 2017.05.31 JP 17196260 2017.10.06
- Main IPC: G03F7/11
- IPC: G03F7/11 ; C08G61/08 ; C09D165/00 ; G03F7/09 ; G03F7/16
Abstract:
A material for forming an underlayer film according to the present invention is a material for forming an underlayer film which is used to form a resist underlayer film used in a multi-layer resist process, the material including a cyclic olefin polymer which has a repeating structural unit [A] represented by Formula (1) and a repeating structural unit [B] represented by Formula (2), in which a molar ratio [A]/[B] of the structural unit [A] to the structural unit [B] in the cyclic olefin polymer is greater than or equal to 5/95 and less than or equal to 95/5.
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Information query
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