Invention Grant
- Patent Title: Mobile terminal with a bendable structure
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Application No.: US17260907Application Date: 2018-07-17
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Publication No.: US11886240B2Publication Date: 2024-01-30
- Inventor: Wentao Bie , Wen Fan , Chia Huan Chang , Qilin Xu , Rui Wang
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Conley Rose, P.C.
- International Application: PCT/CN2018/095964 2018.07.17
- International Announcement: WO2020/014865A 2020.01.23
- Date entered country: 2021-01-15
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K1/14 ; H05K1/02

Abstract:
The mobile terminal includes a first part, a second part, a connection structure, and a flexible circuit board. A signal is transmitted between the first part and the second part through the flexible circuit board. The flexible circuit board includes a first end and a second end. The first end is electrically connected to the first part, and the second end is electrically connected to the second part. The flexible circuit board passes through the connection structure, and a part of the flexible circuit board in the connection structure maintains a regular bending structure.
Public/Granted literature
- US20210263558A1 Mobile Terminal Public/Granted day:2021-08-26
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